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Indoor COB applications


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Display Resolution Explained

Display Effect Explained

Why Flip COB

Flip COB is the most recent trends in LED manufacturing and packaging. This LED has better thermal performance and allow higher power than standard SMD package.

What is Flip COB LED chip?

  • COB: Chip on Board
  • Definition:

COB is a new technology of LED packaging for LED light engine. Multi LED chips are packaged together as one lighting module. When it light up, it looks like a lighting panel.

What is the difference between traditional COB chip and flip COB chip?

(a) and (b) respectively show the schematic diagrams of a traditional wire-bond COB Chip and no wire-bond flip COB chip.

In Figure 1(a), a traditional COB chip is bonded on the MCPCB substrate by bonding epoxy and connects to the circuit electrodes via two bonding wires. The thermal energy generated by the LED chip is dissipated through the chips’ sapphire substrate, bonding epoxy, followed by a MCPCB dielectric layer before reaching the metal core. On the other hand, the flip COB chip shown in Figure 1(b) has the LED chip directly bonded on the circuit electrodes without the bonding wire and epoxy. The heat generated by the LED is coupled through the chip bonding pads, circuit electrodes, MCPCB dielectric layer, and then diffused into the metal core. In comparison, the flip COB chip exhibits less thermal resistance as its thermal dissipating path excludes the sapphire substrate and bonding epoxy that are materials having higher thermal resistance.

Technical Parameters

ParametersUP-0.77BUP-0.925BUP-1.23B
PanelLEDCOB(1R1G1B)COB(1R1G1B)COB(1R1G1B)
Pixel pitch(mm)0.770.9251.23
Module Size(W x H x D mm)148×111148×111148×111
Module Resolution(W x H)192×144160×120120×90
Panel Size(W x H x D mm)293×333293×333293×333
Panel Resolution(W x H)192×432320×360240×270
Weight (kg/pcs)0.68±0.1kg0.74±0.1kg1.36±0.1kg
Power consumption(watts/pcs)534953
Input Voltage(VDC)3.73.73.7
Waterproof module surfaceIP65IP65IP65
CabinetModule quantity (pcs, W x H)4×34×34×3
Resolution(pixels/㎡)768×432640×360480×270
Screen ratio16:916:916:9
Size(W x H x D mm)592x333x37.6592x333x37.6592x333x37.6
Square(㎡)0.1970.1970.197
Weight(kg/㎡)5.655.655.65
Pixel density(pixels/㎡)16829801168736657414
Cabinet Material & ColorDie-casting Aluminum, Black
WaterproofIP3XIP3XIP3X
Flatness of the box(mm)≤0.15≤0.15≤0.15
Optical ParametersColor temperature adjustable(K)3000-100003000-100003000-10000
Color Gamut≥105% NTSC≥105% NTSC≥105% NTSC
Brightness(nits)after correction0-6000-6000-600
White color coordinatesTYP x=0.285,y=0.300±0.003 (9000K standard)
Viewing angle, horizontal(°)≥160≥160≥160
Viewing angle, vertical(°)≥160≥160≥160
Contrast ratio 15000:1 15000:1 15000:1
Electrical ParametersPower consumption, Max.(watts/㎡)540500540
Power consumption, Typical(watts/㎡)180167180
Input voltage(V)AC 100-240  (50/60HZ)AC 100-240  (50/60HZ)AC 100-240  (50/60HZ)
Visual RefreshDrive method1/64 duty scans1/54 duty scans1/60 duty scans
Frame frequency(HZ)50&6050&6050&60
Refresh Rate(HZ)384038403840
Grey scale(bit)141313
Applications

Environment

LED life time(H)100000100000100000
Operating temperature(℃) -10~+40 -10~+40 -10~+40
Storage temperature(℃) -40~+60 -40~+60 -40~+60
Operating humidity(RH)+10~+85%(non-condensing)+10~+85%(non-condensing)+10~+85%(non-condensing)
Storage humidity(RH)+10~+60%(non-condensing)+10~+60%(non-condensing)+10~+60%(non-condensing)

Note: Above parameters only reference, the final interpretation right of the above parameters belongs to ELITESDISPLAY TECHNOLOGY CO., LTD.